OCP & Direct Liquid Cooling Solutions
Powering the next generation of high-density data centers
Nexibox delivers Open Compute Project (OCP) and Direct Liquid Cooling (DLC) solutions designed for modern AI, HPC, and high-density computing environments — combining open, efficient infrastructure with advanced liquid cooling for higher compute density and better thermal management.
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OCP Infrastructure
Leverage Open Compute-inspired designs to build efficient, modular, and scalable data-center infrastructure.
- Open and modular architecture
- High-density compute platforms
- Optimized power and rack design
- Scalable infrastructure
- Designed for AI and HPC workloads
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Direct Liquid Cooling
Our DLC solutions remove heat directly from high-power processors and accelerators, enabling efficient cooling for increasingly dense compute environments.
- Efficient heat removal
- Support for high-density racks
- Improved thermal management
- Reduced reliance on air cooling
- Ready for next-gen CPUs and GPUs
One unified system
Integrated data center solution
Nexibox brings OCP compute, DLC, racks, power, networking, and monitoring together into a unified infrastructure solution — designed around your workload, power availability, cooling requirements, and future growth.
Built for
Build smarter. Cool better. Compute more.
Nexibox OCP and DLC solutions enable the high-density, energy-conscious data centers of tomorrow.